SANTO DOMINGO.-One thousand scholarships in engineering and architecture programs, covering 50% of the tuition cost, is the result of an agreement signed yesterday, Thursday, April 11, by three institutions to promote higher education in the country.
The agreement was signed between Euroinnova Business School (EIOE), the Catholic University of the Northeast (UCNE) and the Dominican College of Engineers, Architects and Surveyors (Codia), a collaboration agreement to promote higher education.
A press release announced that this initiative aims to facilitate the professional development of those working in the aforementioned fields. The scholarships will be awarded by Euroinnova BS.
Furthermore, efforts are being made to strengthen ties between the entities involved, "laying the foundations for future collaborations that will promote educational and professional development in the region," a press release highlights.
As part of this agreement, joint actions will be carried out with Structuralia, an educational institution in the STEM (Science, Technology, Engineering and Mathematics) sector, which is part of the Educa Edtech Group.
"This strategic collaboration seeks to strengthen access to specialized educational opportunities in key areas for professional development, consolidating a shared commitment to academic excellence and technological advancement in the country," the press release highlighted.
The signing of the agreement took place at the Dominican College of Engineers, Architects and Surveyors (Codia), in the Colonial City of Santo Domingo, National District.
Present at the signing of the agreement were Juan A. Villar González, president of Codia; Rafael García Parrado, CEO of Grupo Educa Edtech, from EuroInnova Internacional, an educational institution belonging to the Educa Edtech Group; Robiamny Balcácer, manager for Central America and the Caribbean of EIOE; Reverend Father Isaac García, rector of UCNE; Juan Castillo, vice-rector of Research-Postgraduate Studies, directors and others.
